As a Senior Mechanical Engineer, you will oversee developing advanced packaging solutions including package design, material selections, fabrication processing, qualification, and documentation. You’ll work closely with design engineers, process engineers, supply chain, operations, facilities, and outside consultants. Responsibilities include the development of advanced packaging solutions for photodiode devices for various market segments. You will provide packaging solutions which meet demanding product requirements while balancing the need for reliability and cost. You will follow the NPI gate process, ensure the products meet both internal and customer specifications as required, and that the product is designed for manufacturing. You will also be responsible for ensuring the repeatability and reproducibility of our products and make suggestions where applicable on next gen fabrication/assembly capabilities.

This full-time, exempt position will report to the COO and will be located at our Salem, NH facility. 

Responsibilities

• Perform all aspects of design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.
• Develop and document manufacturing techniques, materials, tools and processes related to back-end Photodiode assembly.
• Performs analyses and selects techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need and customer requirements.
• Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluates and validates process and design alternatives based on product manufacturability.
• Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing.
• Provides processes that are robust and repeatable against product specifications and that support the quoted cost.
• Lead the manufacturing team in the direction for improving and streamlining existing processes for increased accuracy and efficiencies.
• Have a full understanding and up-to-date knowledge of the NPI process as well as the requirements of our current (ISO9001).
• Ensure that all projects assigned are fully auditable to the current site accreditations and work with quality manager to implement any suggested quality improvements.
• Drive meetings and coordinate actions to facility the team with achieving project budget and schedule requirements. Be the Technical Lead to the Business Unit with project plans and customer inquiries.
• Mentor junior staff.
• Other duties as assigned by your manager

Experience

• BS in mechanical engineering or material science or closely related disciplines with at least 8 years of industrial experience in semiconductor or photonics area.
• Fluent with material properties, packaging techniques, and manufacturing disciplines.
• Demonstrated experience of working with engineering teams from different cultures in global environment.
• Strong manufacturing experience which insures high yield along with controlled process.

Preferred Experience

• MSME with 6 years of experience.
• 4 years technical leadership experience in cross-functional teams.
• Experience designing electrical and pneumatic controls systems, specifying electrical and pneumatic control components, and designing the mechanical layout of an electromechanical and/or pneumatic controls system.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEA-based analysis techniques as related to photonics and PIC package designs would be distinct advantage.

MISC:

• Able to lift up to 20lbs
• Travel may be required